About this ebook
The volume explores mechanical characteristics, fatigue and creep behavior, thermal behavior, vibrational analysis, testing, and modeling, with applications across the medical, aerospace, automotive, naval, energy, civil, manufacturing, and electronics sectors. Topics include collagen-based biomedical materials; waste plant fiber-reinforced composites; natural fibers and environmental sustainability; 3D scaffolds for tissue regeneration; surface treatments and property optimization; and natural fiber-reinforced PVC composites. The book also examines the growing role of artificial intelligence and machine learning in predicting material properties and modeling polymer solutions.
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About the author
Pijush Dutta, PhD, is Assistant Professor and Head of Electronics & Communication Engineering at Greater Kolkata College of Engineering and Management, India. His research spans intelligent systems, IoT, machine learning, deep learning, optimization, and control systems. He has published more than 100 research articles and 12 books and holds 14 patents.
Mahuya Das, PhD, is Professor of Chemistry at Bankura Zilla Saradamani Mahila Mahavidyapith, India, and is associated with the University of Calcutta as guest faculty and PhD supervisor. Her research focuses on polymer composites, nanomaterials, advanced materials, and packaging. She has published more than 90 scientific papers and holds six patents.
Barun Haldar, PhD, is a university Professor in Saudi Arabia, appointed to the Industrial Engineering Department at Imam Mohammad Ibn Saud Islamic University. His research interests include mechanical and industrial engineering and sustainable manufacturing. He has published more than 90 scientific papers and holds one US and two Indian patents.
Korhan Cengiz, PhD, is Associate Professor of Electrical-Electronics Engineering at Biruni University, Türkiye. His research encompasses wireless sensor networks, communications, IoT, signal processing, positioning systems, and 5G. He has published more than 40 SCI/SCI-E articles, holds five international patents, and is a senior member of IEEE.
