About this ebook
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. It discusses established techniques, as well as emerging technologies such as digital health, bio-medical, and nano-materials/processing, in addition to microelectronic and optoelectronic packaging. The book therefore provides readers with the most up-to-date developments in advanced packaging.
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of mi...
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Ratings and reviews
1 review
A Google user
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The book provides an excellent coverage of materials aspects of new emerging techniques in the area of WL-CSP and beyond and includes also revolutionary 3D packaging to meet ever increasing demands for thinner, lighter and increased fuctionalty within a small formfactor package at reduced assembly cost.
A Google user
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November 4, 2009
Good book
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