Additive and Advanced Manufacturing, Inverse Problem Methodologies and Machine Learning and Data Science, Volume 4: Proceedings of the 2023 Annual Conference on Experimental and Applied Mechanics

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Additive and Advanced Manufacturing, Inverse Problem Methodologies and Machine Learning and Data Science, Volume 4 of the Proceedings of the 2023 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the fourth volume of five from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of topics and includes papers in the following general technical research areas:

AM Composites and Polymers

Dynamic Behavior of Additively Manufactured Materials and Structures

Joint Residual Stress and Additive Manufacturing

ML for Material Model Identification

Novel AM Structures

Novel Processing and Testing of Additively Manufactured Materials

Plasticity and Complex Material Behavior

Virtual Fields Method.

Additive and Advanced Manufacturing, Inverse Problem Methodologies and Machine Learning and Data Science, Volume 4 of the Proceedings of the 2023 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the fourth volume of five from the Conference, brings together contributions ...

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Sharlotte L.B. Kramer, Sandia National Laboratories, Albuquerque, USA. Emily Retzlaff, United States Naval Academy, Annapolis, USA. Piyush Thakre, Dow Inc., Lake Jackson, USA. Johan Hoefnagels, Eindhoven University of Technology, Eindhoven, The Netherlands. Marco Rossi, Università Politecnica delle Marche, Ancona, Italy. Attilio Lattanzi, California Institute of Technology, Pasadena, USA. François Hemez, Lawrence Livermore National Laboratory, Livermore, USA. Mostafa Mirshekari, Carnegie Mellon University, Pittsburgh, USA. Austin Downey, University of South Carolina, Columbia, USA.
Sharlotte L.B. Kramer, Sandia National Laboratories, Albuquerque, USA. Emily Retzlaff, United States Naval Academy, Annapolis, USA. Piyush Thakre, Dow Inc., Lake Jackson, USA. Johan Hoefnagels, Eindhoven University of Technology, Eindhoven, The Netherlands. Marco Rossi, Università Politecnica del...

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